公开(公告)号：US20170106651A1

公开(公告)日：2017-04-20

申请号：US15120676

申请日：2014-06-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Bradley D. Chung ,  Galen P. Cook ,  Michael H. Hayes ,  Adam L. Ghozeil ,  Chantelle Elizabeth Domingue ,  Valerie J. Marty ,  Anthony M. Fuller ,  Sterling Chaffins

IPC: B41J2/14 ,  B41J29/377

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J29/377

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

公开(公告)号：US09815282B2

公开(公告)日：2017-11-14

申请号：US15120676

申请日：2014-06-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Bradley D. Chung ,  Galen P. Cook ,  Michael H. Hayes ,  Adam L. Ghozeil ,  Chantelle Elizabeth Domingue ,  Valerie J. Marty ,  Anthony M. Fuller ,  Sterling Chaffins

IPC: B41J2/14 ,  B41J2/16 ,  B41J29/377

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J29/377

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.