公开(公告)号：US20200236340A1

公开(公告)日：2020-07-23

申请号：US16746249

申请日：2020-01-17

Applicant: HANWHA TECHWIN CO., LTD.

Inventor： Jong Hyeok LEE ,  Jong Kyung LEE ,  Do Won KO ,  Yong Jun LEE ,  Joong Gyun JEONG

IPC: H04N13/246 ,  H04N13/243

Abstract: Provided are an image sensor module, an image processing module, and an imaging device including the two modules. The image sensor module includes: a plurality of image sensors: a frame in which the image sensors are mounted to have different imaging angles; and at least one memory configured to store calibration information reflecting distance information generated from images obtained by the image sensors, respectively.