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公开(公告)号:US11807696B2
公开(公告)日:2023-11-07
申请号:US16973509
申请日:2019-05-14
发明人: Hyeonuk Kang , Pilje Seong , Kyongjun Yoon , Min Ho Lee , Heejin Jang
IPC分类号: C08F2/01 , C08F232/08
CPC分类号: C08F2/01 , C08F232/08 , C08F2500/02 , C08F2500/25
摘要: The present invention relates to a method for producing a dicyclopentadiene-based resin and a dicyclopentadiene-based resin produced thereby, the method comprising thermal polymerizing under non-catalyst, non-initiator conditions, thereby enabling not only excellent yield, but also, by a low polydispersity index, a narrow molecular weight distribution and the realization of uniform physical properties.