公开(公告)号：US11578196B2

公开(公告)日：2023-02-14

申请号：US16607361

申请日：2018-03-19

申请人： HANGZHOU FIRST APPLIED MATERIAL CO., LTD.

发明人： Long Wang ,  Xi Xiong ,  Guodong Tang ,  Hongbing Hou ,  Guangda Zhou ,  Jianhua Lin

IPC分类号： C08L23/08 ,  C08K3/013 ,  C08K5/00 ,  C08K5/14 ,  C08K5/54 ,  C08L23/14 ,  C08L23/18 ,  C08L23/28 ,  C08L23/32 ,  C08L23/36

摘要： The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

公开(公告)号：US11987734B2

公开(公告)日：2024-05-21

申请号：US18011193

申请日：2021-05-20

申请人： HANGZHOU FIRST APPLIED MATERIAL CO., LTD.

发明人： Haonan Wang ,  Mingjie Cao ,  Yan Sang ,  Hongbing Hou ,  Wei Deng ,  Yunxiao Mei ,  Dayue Jin ,  Chufeng Yang

IPC分类号： H01L31/048 ,  C09J7/29 ,  H01L31/02 ,  H01L31/05 ,  H02S40/38

CPC分类号： C09J7/29 ,  H01L31/02008 ,  H01L31/0481 ,  H01L31/0504 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/162 ,  C09J2301/41 ,  H02S40/38

摘要： The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 Ω·cm.

公开(公告)号：US11905398B2

公开(公告)日：2024-02-20

申请号：US17614574

申请日：2020-08-17

申请人： HANGZHOU FIRST APPLIED MATERIAL CO., LTD.

发明人： Mengjuan Wei ,  Guodong Tang ,  Hongbing Hou ,  Guangda Zhou

IPC分类号： C09J11/08 ,  C09J123/08 ,  C09J151/06 ,  C09J7/10 ,  H01L31/048 ,  B32B17/10 ,  C08J5/18 ,  C08L23/08

CPC分类号： C08L23/0892 ,  C08L23/0815 ,  C08L23/0853 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/025

摘要： Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-α-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

公开(公告)号：US11525043B2

公开(公告)日：2022-12-13

申请号：US16630465

申请日：2018-03-20

申请人： HANGZHOU FIRST APPLIED MATERIAL CO., LTD.

发明人： Mengjuan Wei ,  Yan Sang ,  Guangda Zhou ,  Xi Xiong ,  Hongbing Hou ,  Jianhua Lin

IPC分类号： C08J5/18 ,  C08J3/24 ,  C08K5/07 ,  C08K5/3435 ,  C08K5/39 ,  C08K5/5425 ,  H01L31/048

摘要： The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.