SOLID-STATE IMAGING DEVICE
    1.
    发明申请

    公开(公告)号:US20230115175A1

    公开(公告)日:2023-04-13

    申请号:US17915217

    申请日:2021-01-20

    Abstract: A solid-state imaging device includes a semiconductor substrate having a main surface provided with a plurality of light sensitive regions and an insulating film provided on the main surface of the semiconductor substrate. A plurality of uneven portions are formed on a surface (main surface) on the side opposite to the main surface of the semiconductor substrate in the insulating film and a plurality of height differences of the uneven portions exist in the light sensitive region.

    SPECTROSCOPIC MEASUREMENT DEVICE AND SPECTROMETRY SYSTEM

    公开(公告)号:US20190277697A1

    公开(公告)日:2019-09-12

    申请号:US16347270

    申请日:2017-11-13

    Inventor: Makoto KONO

    Abstract: A spectroscopic measurement device emits light to a measurement target and measures the measurement light output from the measurement target in accordance with the light emission. A spectroscopic measurement device includes: a first housing having a light shielding property and configured to house a light source that emits light and having a first opening through which the light emitted from the light source passes; a second housing having a light shielding property and having a second opening through which the measurement light passes and configured to house a spectrometer that receives the measurement light that has passed through the second opening; and a junction configured to join the first housing and the second housing such that relative positions of the first housing and the second housing can be changed.

    SPECTROSCOPIC MEASUREMENT DEVICE AND SPECTROMETRY SYSTEM

    公开(公告)号:US20190277696A1

    公开(公告)日:2019-09-12

    申请号:US16347259

    申请日:2017-11-13

    Inventor: Makoto KONO

    Abstract: A spectroscopic measurement device emits light to a measurement target and measures the measurement light output from the measurement target in accordance with the light emission. A spectroscopic measurement device includes: a first housing having a light shielding property and configured to house a light source that emits light and having a first opening through which the light emitted from the light source passes; a second housing having a light shielding property and having a second opening through which the measurement light passes and configured to house a spectrometer that receives the measurement light that has passed through the second opening; and an attachment configured to detachably hold the first housing and the second housing.

    SOLID-STATE IMAGING DEVICE
    4.
    发明申请

    公开(公告)号:US20210327929A1

    公开(公告)日:2021-10-21

    申请号:US17285201

    申请日:2019-09-11

    Abstract: A solid-state imaging device according to the disclosure includes a semiconductor substrate which has a main surface having a plurality of photosensitive regions, and an insulating film which is provided on the main surface of the semiconductor substrate. When the main surface of the semiconductor substrate is taken as a reference surface, a thickness of the insulating film from the reference surface is 0.5 μm or more, a surface (a main surface) of the insulating film on the side opposite to the main surface is a surface having flatness, and a plurality of types of bottom surfaces of which depths from the reference surface are different from each other are provided on the main surface of the semiconductor substrate in the photosensitive regions.

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