公开(公告)号：US20230095434A1

公开(公告)日：2023-03-30

申请号：US18074627

申请日：2022-12-05

申请人： Gold Bond Building Products, LLC

发明人： Michael N. Blades ,  John M. Watt ,  John E. Yakowenko ,  Todd D. Broud ,  Keith R. O'Leary ,  Stephen A. Cusa ,  Mauricio Quiros ,  Brian G. Randall ,  Richard P. Weir

IPC分类号： E04B1/84 ,  B32B37/12 ,  E04B1/86 ,  B32B37/14 ,  B32B38/10 ,  B32B9/06 ,  G10K11/168

摘要： A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard comprises a gypsum layer with a gypsum surface having an encasing layer. The encasing layer is partially removed to expose the gypsum surface and form a gypsum surface portion and a first encasing layer portion on the gypsum layer. A sound damping layer is applied to the gypsum layer to cover at least part of the gypsum surface portion and the encasing layer portion.

公开(公告)号：US11939765B2

公开(公告)日：2024-03-26

申请号：US18074627

申请日：2022-12-05

申请人： Gold Bond Building Products, LLC

发明人： Michael N. Blades ,  John M. Watt ,  John E. Yakowenko ,  Todd D. Broud ,  Keith R. O'Leary ,  Stephen A. Cusa ,  Mauricio Quiros ,  Brian G. Randall ,  Richard P. Weir

IPC分类号： E04B1/84 ,  B32B9/06 ,  B32B37/12 ,  B32B37/14 ,  B32B38/10 ,  E04B1/86 ,  F16B11/00 ,  G10K11/168

CPC分类号： E04B1/8409 ,  B32B9/06 ,  B32B37/12 ,  B32B37/14 ,  B32B38/10 ,  E04B1/86 ,  G10K11/168 ,  B32B2307/102 ,  B32B2315/18 ,  B32B2607/00 ,  E04B2001/8461 ,  F16B11/006

摘要： A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard comprises a gypsum layer with a gypsum surface having an encasing layer. The encasing layer is partially removed to expose the gypsum surface and form a gypsum surface portion and a first encasing layer portion on the gypsum layer. A sound damping layer is applied to the gypsum layer to cover at least part of the gypsum surface portion and the encasing layer portion.