公开(公告)号：US12189183B2

公开(公告)日：2025-01-07

申请号：US18046189

申请日：2022-10-13

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Won Suk Lee ,  Andreas D. Stricker

IPC: G02B6/126 ,  G02B6/122 ,  G02B6/27 ,  G02B6/12 ,  G02B6/125

Abstract: A structure includes a polarization device such as a polarization splitter, a polarization combiner or a polarization splitter rotator including a waveguide having a light absorber at an end section with an at least hook shape, e.g., it can be hooked or spiral shape. The structure also includes another waveguide adjacent the stated waveguide. The hook or spiral shape acts as a light absorber that reduces undesired optical noise such as excessive light insertion loss and/or light scattering. The hook or spiral shape may also be used on supplemental waveguides used to further filter and/or refine an optical signal in one of the waveguides of the polarization device, e.g., downstream of an output section of the polarization splitter and/or rotator.

公开(公告)号：US11569180B2

公开(公告)日：2023-01-31

申请号：US17400847

申请日：2021-08-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Mohamed A. Rabie ,  Andreas D. Stricker

IPC: H01L23/522 ,  H01L31/02 ,  H01L33/62 ,  H01L23/00

Abstract: Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

公开(公告)号：US11204463B1

公开(公告)日：2021-12-21

申请号：US16931771

申请日：2020-07-17

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an optical medium for light signals; and an optical grating coupler coupled to the optical medium. The optical grating coupler is configured to reorient light from the optical medium. A cladding material is over the optical grating coupler. An absorber layer is over the cladding material, and vertically above the optical grating coupler.

公开(公告)号：US20210375788A1

公开(公告)日：2021-12-02

申请号：US17400847

申请日：2021-08-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Mohamed A. Rabie ,  Andreas D. Stricker

IPC: H01L23/00 ,  H01L23/522 ,  H01L31/02 ,  H01L33/62

Abstract: Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

公开(公告)号：US11145606B1

公开(公告)日：2021-10-12

申请号：US16830543

申请日：2020-03-26

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Mohamed A. Rabie ,  Andreas D. Stricker

IPC: H01L23/00 ,  H01L23/522 ,  H01L31/02 ,  H01L33/62

Abstract: Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

公开(公告)号：US20240126013A1

公开(公告)日：2024-04-18

申请号：US18046189

申请日：2022-10-13

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Won Suk Lee ,  Andreas D. Stricker

IPC: G02B6/126 ,  G02B6/122

CPC classification number: G02B6/126 ,  G02B6/1228

Abstract: A structure includes a polarization device such as a polarization splitter, a polarization combiner or a polarization splitter rotator including a waveguide having a light absorber at an end section with an at least hook shape, e.g., it can be hooked or spiral shape. The structure also includes another waveguide adjacent the stated waveguide. The hook or spiral shape acts as a light absorber that reduces undesired optical noise such as excessive light insertion loss and/or light scattering. The hook or spiral shape may also be used on supplemental waveguides used to further filter and/or refine an optical signal in one of the waveguides of the polarization device, e.g., downstream of an output section of the polarization splitter and/or rotator.

公开(公告)号：US11536900B2

公开(公告)日：2022-12-27

申请号：US17453533

申请日：2021-11-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an absorber layer separated from an optical grating coupler by a cladding material. The absorber is positioned to receive light reoriented through the optical grating coupler.

公开(公告)号：US20220344523A1

公开(公告)日：2022-10-27

申请号：US17241525

申请日：2021-04-27

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Asif J. Chowdhury ,  Yusheng Bian ,  Abdelsalam Aboketaf ,  Andreas D. Stricker

IPC: H01L31/0232 ,  G02B6/24

Abstract: Structures for a photodetector or light absorber and methods of forming a structure for a photodetector or light absorber. The structure includes a pad, a waveguide core adjoined to the pad, and a light-absorbing layer on the pad. The waveguide core includes a first longitudinal axis, and the light-absorbing layer includes a second longitudinal axis and an end surface intersected by the second longitudinal axis. The end surface of the light-absorbing layer is positioned adjacent to the waveguide core. The first longitudinal axis of the first waveguide core is inclined relative to the second longitudinal axis of the light-absorbing layer and/or the end surface slanted relative to the second longitudinal axis.

公开(公告)号：US20210389521A1

公开(公告)日：2021-12-16

申请号：US16901509

申请日：2020-06-15

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Judson Holt ,  Yusheng Bian ,  Andreas D. Stricker ,  Colleen Meagher ,  Michal Rakowski

IPC: G02B6/12 ,  G02B6/13 ,  H01L31/0232 ,  H01L31/028 ,  H01L31/18

Abstract: Structures for a photodetector and methods of fabricating a structure for a photodetector. A photodetector may have a light-absorbing layer comprised of germanium. A waveguide core may be coupled to the light-absorbing layer. The waveguide core may be comprised of a dielectric material, such as silicon nitride. Another waveguide core, which may be comprised of a different material such as single-crystal silicon, may be coupled to the light-absorbing layer.

公开(公告)号：US20230408763A1

公开(公告)日：2023-12-21

申请号：US17807257

申请日：2022-06-16

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yusheng Bian ,  Andreas D. Stricker

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/122 ,  G02B2006/12126 ,  G02B6/13

Abstract: The disclosure relates to a PIC structure including a photonic component on a semiconductor substrate. A passive optical guard is composed of a light absorbing material and is in proximity to the photonic component. The passive optical guard includes at least a portion in an active semiconductor layer of the semiconductor substrate and may be entirely below a first metal layer. The passive optical guard may include at least one of: a germanium body positioned at least partially in a silicon element in the active semiconductor layer, a silicon body having a high dopant concentration in the active semiconductor layer, and a polysilicon body having a high dopant concentration over the silicon body.