公开(公告)号：US20140360886A1

公开(公告)日：2014-12-11

申请号：US13912678

申请日：2013-06-07

Applicant: General Electric Company

Inventor： Guruprasad Sundararajan ,  Marko Klaus Baller ,  Swarnagowri Addepalli ,  Satyanarayanan Seshadri ,  Dinesh R. Rakwal ,  Subhashish Dasgupta ,  Heikki Haveri

IPC: C25F3/14

CPC classification number: C25F3/06 ,  B23H3/00 ,  B23H3/08 ,  B23H9/00 ,  B23H9/14

Abstract: The present disclosure relates to methods for manufacturing porous mesh plates for use in ultrasonic mesh nebulizers, and the porous mesh plates manufactured by those methods. Cone-shaped dimples are first drilled in a substrate (e.g. a plate), but do not penetrate the bottom of the substrate. Next, the substrate (e.g. a plate) is subject to an electrochemical process to remove a layer of material from the surface of the substrate. Enough material is removed to allow the dimples to penetrate the substrate, thereby creating holes in the substrate. The size of the holes can be controlled by the conditions of the electrochemical process.

Abstract translation: 本公开涉及用于制造用于超声波网式喷雾器的多孔网板的方法和通过这些方法制造的多孔网板。 首先在衬底（例如板）中钻出锥形凹坑，但不穿透衬底的底部。 接下来，基板（例如板）经受电化学处理以从基板的表面去除一层材料。 去除足够的材料以允许凹坑穿透基底，从而在基底中产生孔。 孔的大小可以通过电化学过程的条件来控制。

公开(公告)号：US09303330B2

公开(公告)日：2016-04-05

申请号：US13912678

申请日：2013-06-07

Applicant: General Electric Company

Inventor： Guruprasad Sundararajan ,  Marko Klaus Baller ,  Swarnagowri Addepalli ,  Satyanarayanan Seshadri ,  Dinesh R. Rakwal ,  Subhashish Dasgupta ,  Heikki Haveri

IPC: B23H3/00 ,  B23H9/14 ,  C25F3/06 ,  B23H9/00 ,  B23H3/08

CPC classification number: C25F3/06 ,  B23H3/00 ,  B23H3/08 ,  B23H9/00 ,  B23H9/14

Abstract: The present disclosure relates to methods for manufacturing porous mesh plates for use in ultrasonic mesh nebulizers, and the porous mesh plates manufactured by those methods. Cone-shaped dimples are first drilled in a substrate (e.g. a plate), but do not penetrate the bottom of the substrate. Next, the substrate (e.g. a plate) is subject to an electrochemical process to remove a layer of material from the surface of the substrate. Enough material is removed to allow the dimples to penetrate the substrate, thereby creating holes in the substrate. The size of the holes can be controlled by the conditions of the electrochemical process.

Abstract translation: 本公开涉及用于制造用于超声波网式喷雾器的多孔网板的方法和通过这些方法制造的多孔网板。 首先在衬底（例如板）中钻出锥形凹坑，但不穿透衬底的底部。 接下来，基板（例如板）经受电化学处理以从基板的表面去除一层材料。 去除足够的材料以允许凹坑穿透基底，从而在基底中产生孔。 孔的大小可以通过电化学过程的条件来控制。