Abstract:
A direct-conversion X-ray detector includes one or more detector modules. The detector modules can include a substrate, one or more sensor tiles, and one or more photon-counting application specific integrated circuit (ASIC). The substrate has a dielectric constant of less than about 3.5 and is capable of lithographic conductor patterning with feature sizes of about 5 um or less. The one or more X-ray direct conversion sensor tiles have an array of one or more electrodes electrically coupled to a first surface of the substrate. The one or more ASICs are electrically coupled to the substrate and disposed laterally along the substrate with respect to the one or more direct conversion sensor tiles. Conductive lines are spaced along the substrate and are configured to electrically couple the one or more X-ray direct conversion sensor tiles to the one or more ASICs.