公开(公告)号：US20140348290A1

公开(公告)日：2014-11-27

申请号：US13901198

申请日：2013-05-23

Applicant: General Electric Company

Inventor： Daniel David Harrison ,  James Rose ,  Abdelaziz Ikhlef ,  Vladimir Lobastov

IPC: G01T1/16 ,  G01N23/04

CPC classification number: G01N23/046 ,  G01T1/244

Abstract: A direct-conversion X-ray detector includes one or more detector modules. The detector modules can include a substrate, one or more sensor tiles, and one or more photon-counting application specific integrated circuit (ASIC). The substrate has a dielectric constant of less than about 3.5 and is capable of lithographic conductor patterning with feature sizes of about 5 um or less. The one or more X-ray direct conversion sensor tiles have an array of one or more electrodes electrically coupled to a first surface of the substrate. The one or more ASICs are electrically coupled to the substrate and disposed laterally along the substrate with respect to the one or more direct conversion sensor tiles. Conductive lines are spaced along the substrate and are configured to electrically couple the one or more X-ray direct conversion sensor tiles to the one or more ASICs.

Abstract translation: 直接转换X射线检测器包括一个或多个检测器模块。 检测器模块可以包括基板，一个或多个传感器瓦片以及一个或多个光子计数专用集成电路（ASIC）。 该基片具有小于约3.5的介电常数，并且能够具有大约5um或更小的特征尺寸的平版印刷导体图案化。 一个或多个X射线直接转换传感器瓦片具有电耦合到基板的第一表面的一个或多个电极的阵列。 一个或多个ASIC电耦合到衬底并相对于一个或多个直接转换传感器瓦片沿着衬底横向设置。 导电线沿着衬底间隔开并且被配置为将一个或多个X射线直接转换传感器瓦片电耦合到一个或多个ASIC。