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公开(公告)号:US12035102B2
公开(公告)日:2024-07-09
申请号:US17786586
申请日:2020-11-11
Applicant: GOERTEK INC.
Inventor: Jiapeng Niu , Zhijun Sun
Abstract: Provided are a sound absorbing material encapsulation structure for a sound production device, and a sound production device. The sound absorbing material encapsulation structure comprises: a rigid cavity wall enclosed to form a cavity of the sound absorbing material encapsulation structure, the cavity is configured to accommodate a sound absorbing material, the rigid cavity wall is provided with air permeability holes arranged in an array, the air permeability holes are configured to form a channel for air to flow in and out of the sound absorbing material encapsulation structure, diameters of air permeability holes are smaller than a diameter of sound absorbing material; a bottom plate sealed and connected to one end surface of rigid cavity wall, the bottom plate is configured to support the sound absorbing material; a covering plate provided to cover another end surface of rigid cavity wall and sealed and connected to the rigid cavity wall.
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公开(公告)号:US10484766B2
公开(公告)日:2019-11-19
申请号:US16080843
申请日:2016-05-18
Applicant: GOERTEK INC.
Inventor: Xinxiang Huo , Yun Yang , Zhijun Sun
Abstract: Disclosed in the present invention is a speaker module. The speaker module comprises a housing, and a speaker unit located within the inner chamber of the housing. The speaker unit separates the inner chamber into a front sound chamber and a rear sound chamber which are isolated from each other. The housing is embedded with a metal sheet, the metal sheet being provided with a pressure relief hole which is acoustically sealed and used for communicating a rear sound chamber and the external environment. The pressure relief hole is provided with a mesh on the side away from the rear sound chamber. The speaker module provided by the present invention has a housing embedded with a metal sheet, the metal sheet being provided with a pressure relief hole. The inner diameter of the pressure relief hole can be made small according to actual needs. The rear sound chamber and the external environment can reach an air pressure balance and have good acoustic seal effect without additional arrangement of pressure relief groove. Furthermore, the pressure relief hole of the speaker module does not need a gland. The structure is simple and the yield rate is high.
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