公开(公告)号：US09271435B2

公开(公告)日：2016-02-23

申请号：US13653598

申请日：2012-10-17

Applicant: GOERTEK INC.

Inventor： Rongguo Yao ,  Zhongyuan Liu ,  Xianbin Wang ,  Maoqiang Dang ,  Shaoyang Yao

IPC: H04R19/04 ,  H05K13/04 ,  B23P17/04

CPC classification number: H05K13/046 ,  B23P17/04 ,  H04R19/04 ,  Y10T29/49 ,  Y10T29/49005 ,  Y10T29/4957 ,  Y10T29/49993

Abstract: A method of manufacturing a protection frame used in a miniature microphone is provided. In one embodiment, the method comprises the steps of: (1) preparing a substrate made of an insulating material with a prescribed thickness and a prescribed area; (2) forming a plurality of holes at prescribed intervals on the substrate; (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes formed on the substrate; (4) filling an insulating material in the plurality of holes; (5) forming a plurality of extended portions on the surfaces of both sides of the substrate, each extended portion covering a part of the end face of the insulating material and the whole end face of the first metal shielding layer of a hole; (6) forming a cavity in each insulating material-filled hole, the caliber of each cavity being slightly smaller than the inner caliber of the corresponding extended portion formed in the above mentioned step (5); and (7) cutting the plurality of holes from the substrate to produce a collection of protection frames.

Abstract translation: 提供一种制造用于微型麦克风的保护框架的方法。 在一个实施例中，该方法包括以下步骤：（1）制备由具有规定厚度和规定面积的绝缘材料制成的基板; （2）在基板上以规定的间隔形成多个孔; （3）在形成在基板上的多个孔的内表面上形成第一金属屏蔽层; （4）在多个孔中填充绝缘材料; （5）在基板的两面的表面上形成多个延伸部，每个延伸部分覆盖绝缘材料的端面的一部分和孔的第一金属屏蔽层的整个端面; （6）在每个绝缘材料填充孔中形成空腔，每个空腔的口径略小于在上述步骤（5）中形成的对应延伸部分的内口径; 和（7）从所述基板切割所述多个孔以产生保护框架的集合。

公开(公告)号：US20130104379A1

公开(公告)日：2013-05-02

申请号：US13653598

申请日：2012-10-17

Applicant: GOERTEK INC.

Inventor： Rongguo Yao ,  Zhongyuan Liu ,  Xianbin Wang ,  Maoqiang Dang ,  Shaoyang Yao

IPC: H05K13/04 ,  B23P17/04

CPC classification number: H05K13/046 ,  B23P17/04 ,  H04R19/04 ,  Y10T29/49 ,  Y10T29/49005 ,  Y10T29/4957 ,  Y10T29/49993

Abstract: A method of manufacturing a protection frame used in a miniature microphone is provided. In one embodiment, the method comprises the steps of: (1) preparing a substrate made of an insulating material with a prescribed thickness and a prescribed area; (2) forming a plurality of holes at prescribed intervals on the substrate; (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes formed on the substrate; (4) filling an insulating material in the plurality of holes; (5) forming a plurality of extended portions on the surfaces of both sides of the substrate, each extended portion covering a part of the end face of the insulating material and the whole end face of the first metal shielding layer of a hole; (6) forming a cavity in each insulating material-filled hole, the caliber of each cavity being slightly smaller than the inner caliber of the corresponding extended portion formed in the above mentioned step (5); and (7) cutting the plurality of holes from the substrate to produce a collection of protection frames.

Abstract translation: 提供一种制造用于微型麦克风的保护框架的方法。 在一个实施例中，该方法包括以下步骤：（1）制备由具有规定厚度和规定面积的绝缘材料制成的基板; （2）在基板上以规定的间隔形成多个孔; （3）在形成在基板上的多个孔的内表面上形成第一金属屏蔽层; （4）在多个孔中填充绝缘材料; （5）在基板的两面的表面上形成多个延伸部，每个延伸部分覆盖绝缘材料的端面的一部分和孔的第一金属屏蔽层的整个端面; （6）在每个绝缘材料填充孔中形成空腔，每个空腔的口径略小于在上述步骤（5）中形成的对应延伸部分的内口径; 和（7）从所述基板切割所述多个孔以产生保护框架的集合。