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公开(公告)号:US11109162B2
公开(公告)日:2021-08-31
申请号:US16609194
申请日:2017-05-05
Applicant: GOERTEK INC.
Inventor: Quanbo Zou , Zhe Wang , Jialiang Yan
Abstract: A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.
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公开(公告)号:US11099467B2
公开(公告)日:2021-08-24
申请号:US16483156
申请日:2017-02-06
Applicant: GOERTEK INC.
Inventor: Zhe Wang , Quanbo Zou , Qinglin Song , Jialiang Yan , Yujing Lin , Xiaoyang Zhang
Abstract: A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.
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公开(公告)号:US20200092658A1
公开(公告)日:2020-03-19
申请号:US16609194
申请日:2017-05-05
Applicant: GOERTEK INC.
Inventor: Quanbo Zou , Zhe Wang , Jialiang Yan
Abstract: A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.
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