INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND SEMICONDUCTOR MANUFACTURING SYSTEM

    公开(公告)号:US20220342311A1

    公开(公告)日:2022-10-27

    申请号:US17858674

    申请日:2022-07-06

    Abstract: An information processing device includes a processor and a storage device. The processor is configured to acquire data for each parameter provided from each of a light source device which generates pulse light and an exposure apparatus which performs exposure on a wafer with the pulse light output from the light source device, and time data associated with the data; to perform classification, based on the acquired data and time data, for each record of the data associated with same time data for distinguishing whether being data during exposure in which the wafer is irradiated with the pulse light or being data during non-exposure; to associate attribute information indicating an attribute according to the classification with each of the records; to cause the storage device to store the data and the time data associated with the attribute information; and to generate a chart using data read from the storage device.

    LASER UNIT MANAGEMENT SYSTEM
    3.
    发明申请

    公开(公告)号:US20180196347A1

    公开(公告)日:2018-07-12

    申请号:US15914299

    申请日:2018-03-07

    Abstract: A laser unit management system may include a server configured to hold first information provided with access limitation that allows an access with a first access authorization, second information provided with access limitation that allows an access with a second access authorization, and third information provided with access limitation that allows both an access with the first access authorization and an access with the second access authorization; and a laser unit including a laser output section and a controller, the laser output section being configured to output pulsed laser light toward an exposure unit that is configured to perform wafer exposure, the controller being configured to store the first information, the second information, and the third information in the server. The second information may include wafer-exposure-related information on the exposure unit and laser-control-related information on the laser unit that are in association with each other.

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