公开(公告)号：US20220412219A1

公开(公告)日：2022-12-29

申请号：US17894414

申请日：2022-08-24

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Aaron Ezekiel Smith ,  Metodi Blagoev Zlatinov ,  Thomas Earl Dyson

IPC: F01D5/18

Abstract: A component is provided and comprises at least one wall comprising a first and a second surface. At least one film cooling; hole extends through the wall between the first and second surfaces and has an outlet region at the second surface. The film cooling hole includes a first expansion section being a side diffusion portion and a second expansion section being a layback diffusion portion, wherein the side diffusion portion is upstream and spaced from the layback diffusion portion.

公开(公告)号：US20190003314A1

公开(公告)日：2019-01-03

申请号：US16122536

申请日：2018-09-05

Applicant: General Electric Company

Inventor： Aaron Ezekiel Smith ,  Metodi Blagoev Zlatinov ,  Thomas Earl Dyson

IPC: F01D5/18

Abstract: A component is provided and comprises at least one wall comprising a first and a second surface. At least one film cooling hole extends through the wall between the first and second surfaces and has an outlet region at the second surface. The film cooling hole includes a first expansion section being a side diffusion portion and a second expansion section being a layback diffusion portion, wherein the side diffusion portion is upstream and spaced from the layback diffusion portion.

公开(公告)号：US20170130592A1

公开(公告)日：2017-05-11

申请号：US14938261

申请日：2015-11-11

Applicant: General Electric Company

Inventor： Aaron Ezekiel Smith ,  Metodi Blagoev Zlatinov ,  Thomas Earl Dyson

IPC: F01D5/18

CPC classification number: F01D5/186 ,  F05D2260/202 ,  Y02T50/672 ,  Y02T50/676

Abstract: A component is provided and comprises at least one wall comprising a first and a second surface. At least one film cooling hole extends through the wall between the first and second surfaces and has an outlet region at the second surface. The film cooling hole includes a first expansion section being a side diffusion portion and a second expansion section being a layback diffusion portion, wherein the side diffusion portion is upstream and spaced from the layback diffusion portion.

公开(公告)号：US11773729B2

公开(公告)日：2023-10-03

申请号：US17894414

申请日：2022-08-24

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Aaron Ezekiel Smith ,  Metodi Blagoev Zlatinov ,  Thomas Earl Dyson

IPC: F01D5/18

CPC classification number: F01D5/186 ,  F05D2260/202 ,  Y02T50/60

Abstract: A component is provided and comprises at least one wall comprising a first and a second surface. At least one film cooling; hole extends through the wall between the first and second surfaces and has an outlet region at the second surface. The film cooling hole includes a first expansion section being a side diffusion portion and a second expansion section being a layback diffusion portion, wherein the side diffusion portion is upstream and spaced from the layback diffusion portion.

公开(公告)号：US11466575B2

公开(公告)日：2022-10-11

申请号：US16122536

申请日：2018-09-05

Applicant: General Electric Company

Inventor： Aaron Ezekiel Smith ,  Metodi Blagoev Zlatinov ,  Thomas Earl Dyson

IPC: F01D5/18

Abstract: A component is provided and comprises at least one wall comprising a first and a second surface. At least one film cooling hole extends through the wall between the first and second surfaces and has an outlet region at the second surface. The film cooling hole includes a first expansion section being a side diffusion portion and a second expansion section being a layback diffusion portion, wherein the side diffusion portion is upstream and spaced from the layback diffusion portion.

公开(公告)号：US10094226B2

公开(公告)日：2018-10-09

申请号：US14938261

申请日：2015-11-11

Applicant: General Electric Company

Inventor： Aaron Ezekiel Smith ,  Metodi Blagoev Zlatinov ,  Thomas Earl Dyson

IPC: F01D5/18

Abstract: A component is provided and comprises at least one wall comprising a first and a second surface. At least one film cooling hole extends through the wall between the first and second surfaces and has an outlet region at the second surface. The film cooling hole includes a first expansion section being a side diffusion portion and a second expansion section being a layback diffusion portion, wherein the side diffusion portion is upstream and spaced from the layback diffusion portion.