公开(公告)号：US20220225501A1

公开(公告)日：2022-07-14

申请号：US17272736

申请日：2019-09-06

申请人： Ferro Corporation

发明人： Umesh Kumar ,  John J. Maloney ,  Bradford Smith ,  Ponnusamy Palanisamy ,  Srinivasan Sridharan ,  George E. Sakoske, Jr. ,  George E. Graddy, Jr.

IPC分类号： H05K1/09 ,  B33Y80/00 ,  B22F1/00 ,  B22F7/04 ,  B33Y10/00 ,  B22F10/10 ,  B41M1/12 ,  B41M1/34 ,  B41M5/00 ,  C09D5/24 ,  C09D17/00

摘要： Conductive thick film compositions compatible to aluminum nitride, alumina and silicon nitride substrates for microelectronic circuit application. The conductive thick film composition includes first copper powder, second copper powder, and glass component. The conductive thick film composition further includes CU2O, Ag, and at least one metal element selected from Ti, V, Zr, Mn, Cr, Co, and Sn. After firing, the conductive thick film composition exhibit improved sheet resistivity, and improved adhesion with underlying substrate.