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    Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method
    4.
    发明授权
    Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method 有权
    超导成膜基板，超导线及超导线制造方法

    公开(公告)号：US09002424B2

    公开(公告)日：2015-04-07

    申请号：US14236188

    申请日：2013-02-06

    申请人： Furukawa Electric Co., Ltd.

    发明人： Yoshinori Nagasu ,  Masaru Higuchi ,  Hisaki Sakamoto

    IPC分类号： H01L39/24 ,  H01B12/04 ,  H01B13/30

    CPC分类号： H01B12/04 ,  C23C14/024 ,  C23C14/028 ,  C23C14/087 ,  H01B13/30 ,  H01L39/143 ,  H01L39/24 ,  H01L39/2454 ,  Y10T428/24488

    摘要： A tape-shaped superconducting film-forming substrate is disclosed, which includes a film-forming face for forming a laminate including a superconducting layer thereon, a rear face that is a face at a side opposite to the film-forming face, a pair of end faces connected to the film-forming face and the rear face, and a pair of side faces connected to the film-forming face, the rear face, and the pair of end faces, in which each of the pair of side faces includes a spreading face that spreads toward an outer side in an in-plane direction of the film-forming face from an edge part of the film-forming face toward the rear face side. A superconducting wire and a superconducting wire manufacturing method are also disclosed.

    摘要翻译： 公开了一种带状超导膜形成基板，其包括用于形成包括其上的超导层的层压体的成膜面，作为与成膜面相反侧的面的背面，一对 连接到成膜面和后表面的端面以及连接到成膜面，后表面和一对端面的一对侧面，其中一对侧面中的每一个包括一个 从成膜面的边缘部朝向背面侧朝向成膜面的面内方向的外侧扩展的扩散面。 还公开了超导线和超导线制造方法。

    Connection structure for superconductor wires
    5.
    发明授权
    Connection structure for superconductor wires 有权

    公开(公告)号：US11289829B2

    公开(公告)日：2022-03-29

    申请号：US16488860

    申请日：2018-02-27

    申请人： FURUKAWA ELECTRIC CO., LTD.

    发明人： Satoshi Yamano ,  Akinobu Nakai ,  Hisaki Sakamoto

    IPC分类号： H01R4/02 ,  H01R4/68 ,  H01B12/06

    摘要： Provided is a connection structure for superconductor wires, in which two superconductor wires include respective oxide superconducting conductor layers each formed on one surface of a base material. The oxide superconducting conductor layers are conjoined with each other while facing each other at a connected end of each of the two superconductor wires. An embedment material for reinforcement is provided from one of the two superconductor wires to the other one of the two superconductor wires in a thickness direction of the two superconductor wires at the connected end of each of the two superconductor wires.

    SUPERCONDUCTING WIRE
    6.
    发明申请
    SUPERCONDUCTING WIRE 审中-公开
    超导线

    公开(公告)号：US20150279519A1

    公开(公告)日：2015-10-01

    申请号：US14236899

    申请日：2013-06-26

    申请人： FURUKAWA ELECTRIC CO., LTD.

    发明人： Masaru Higuchi ,  Hisaki Sakamoto ,  Nobuaki Orita ,  Norihisa Shibayama

    IPC分类号： H01B12/06 ,  H01L39/12 ,  H01L39/24 ,  H01B13/30

    CPC分类号： H01B12/06 ,  H01B13/30 ,  H01L39/125 ,  H01L39/24 ,  H01L39/2461

    摘要： A superconducting wire is provided which allows an appropriate critical current property to be obtained while maintaining high adhesive strength based on smoothness of a substrate surface that can be achieved without mechanical polishing or the like. A first intermediate layer 21 is formed by coating a material solution on a substrate 10 with a maximum height roughness Rz of 10 nm or more. This improves surface smoothness of the first intermediate layer 21, improves orientation and smoothness of a second intermediate layer 22 formed on the first intermediate layer 21, and increases a critical current in an oxide superconducting layer 30. Furthermore, the first intermediate layer 21 is formed of a plurality of thin coating film layers 21i. The thin coating film layers 21i are deposited such that an uppermost thin coating film layer has a smaller film thickness than a lowermost thin coating film layer and/or a material solution used for the uppermost thin coating film layer has a lower viscosity than a material solution used for the lowermost thin coating film layer. This improves the surface smoothness of the first intermediate layer 21.

    摘要翻译： 提供了一种超导线，其允许在基于在没有机械抛光等的情况下可以实现的基板表面的平滑度的同时保持高粘合强度的同时获得适当的临界电流特性。 第一中间层21通过以10nm以上的最大高度粗糙度Rz在基板10上涂布材料溶液而形成。 这提高了第一中间层21的表面平滑度，改善了形成在第一中间层21上的第二中间层22的取向和平滑度，并且增加了氧化物超导层30中的临界电流。此外，形成第一中间层21 的多个薄膜层21i。 沉积薄的涂膜层21i，使得最薄的涂膜层的膜厚比最下面的薄膜层薄，和/或用于最上面的薄涂层层的材料溶液的粘度低于材料溶液 用于最薄的薄膜层。 这提高了第一中间层21的表面平滑度。

    SUPERCONDUCTING FILM-FORMING SUBSTRATE, SUPERCONDUCTING WIRE, AND SUPERCONDUCTING WIRE MANUFACTURING METHOD
    7.
    发明申请
    SUPERCONDUCTING FILM-FORMING SUBSTRATE, SUPERCONDUCTING WIRE, AND SUPERCONDUCTING WIRE MANUFACTURING METHOD 有权
    超导膜成型基板，超导线和超导线制造方法

    公开(公告)号：US20150038334A1

    公开(公告)日：2015-02-05

    申请号：US14236188

    申请日：2013-02-06

    申请人： FURUKAWA ELECTRIC CO., LTD.

    发明人： Yoshinori Nagasu ,  Masaru Higuchi ,  Hisaki Sakamoto

    IPC分类号： H01B12/04 ,  H01L39/24 ,  H01B13/30

    CPC分类号： H01B12/04 ,  C23C14/024 ,  C23C14/028 ,  C23C14/087 ,  H01B13/30 ,  H01L39/143 ,  H01L39/24 ,  H01L39/2454 ,  Y10T428/24488

    摘要： A tape-shaped superconducting film-forming substrate is disclosed, which includes a film-forming face for forming a laminate including a superconducting layer thereon, a rear face that is a face at a side opposite to the film-forming face, a pair of end faces connected to the film-forming face and the rear face, and a pair of side faces connected to the film-forming face, the rear face, and the pair of end faces, in which each of the pair of side faces includes a spreading face that spreads toward an outer side in an in-plane direction of the film-forming face from an edge part of the film-forming face toward the rear face side. A superconducting wire and a superconducting wire manufacturing method are also disclosed.

    摘要翻译： 公开了一种带状超导膜形成基板，其包括用于形成包括其上的超导层的层压体的成膜面，作为与成膜面相反侧的面的背面，一对 连接到成膜面和后表面的端面以及连接到成膜面，后表面和一对端面的一对侧面，其中一对侧面中的每一个包括一个 从成膜面的边缘部朝向背面侧朝向成膜面的面内方向的外侧扩展的扩散面。 还公开了超导线和超导线制造方法。