公开(公告)号：US20160174425A1

公开(公告)日：2016-06-16

申请号：US14908438

申请日：2013-07-31

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Tetsuo HAYASHI ,  Kuniyasu NAKANE ,  Chikashi TESHIMA

IPC分类号： H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0404 ,  H05K3/303 ,  H05K9/0032 ,  H05K9/0035 ,  H05K13/046 ,  H05K13/08 ,  Y10T29/53174 ,  Y10T29/53252

摘要： An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.

摘要翻译： 一种电子部件安装装置，包括：板传送装置，其传送并定位其上安装有电子部件的板; 安装装置，其将电子部件定位并安装到板的安装位置; 拾取多个接合构件（夹子）的装载装置，以及将接合构件定位并加载到板的装载位置; 以及放置装置，其拾取覆盖所安装的电子部件并且在预定位置处设置有接合部的盖部件，并且将所述盖部件定位并放置到使得所述接合部对应于所述被接合部件的位置。