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公开(公告)号:US20220216638A1
公开(公告)日:2022-07-07
申请号:US17576819
申请日:2022-01-14
申请人: FCI USA LLC
发明人: Aymeric Soudy , Cyril Jeune , Arnaud Hyppias
IPC分类号: H01R13/436 , H01R13/627 , H01R13/428 , H01R4/18
摘要: In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
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公开(公告)号:US11870176B2
公开(公告)日:2024-01-09
申请号:US17576819
申请日:2022-01-14
申请人: FCI USA LLC
发明人: Aymeric Soudy , Cyril Jeune , Arnaud Hyppias
IPC分类号: H01R13/436 , H01R13/627 , H01R13/428 , H01R4/18
CPC分类号: H01R13/4367 , H01R4/185 , H01R13/428 , H01R13/4362 , H01R13/6272 , H01R13/6275
摘要: In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
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公开(公告)号:US11228130B2
公开(公告)日:2022-01-18
申请号:US16355286
申请日:2019-03-15
申请人: FCI USA LLC
发明人: Aymeric Soudy , Cyril Jeune , Arnaud Hyppias
IPC分类号: H01R13/436 , H01R13/627 , H01R13/428 , H01R4/18
摘要: In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
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公开(公告)号:US20240170881A1
公开(公告)日:2024-05-23
申请号:US18522067
申请日:2023-11-28
申请人: FCI USA LLC
发明人: Aymeric Soudy , Cyril Jeune , Amaud Hyppias
IPC分类号: H01R13/436 , H01R4/18 , H01R13/428 , H01R13/627
CPC分类号: H01R13/4367 , H01R4/185 , H01R13/428 , H01R13/4362 , H01R13/6272 , H01R13/6275
摘要: In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
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公开(公告)号:US20190288436A1
公开(公告)日:2019-09-19
申请号:US16355286
申请日:2019-03-15
申请人: FCI USA LLC
发明人: Aymeric Soudy , Cyril Jeune , Arnaud Hyppias
IPC分类号: H01R13/436 , H01R4/18 , H01R13/428 , H01R13/627
摘要: In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
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