公开(公告)号：US20180138152A1

公开(公告)日：2018-05-17

申请号：US15793018

申请日：2017-10-25

申请人： FAIRCHILD KOREA SEMICONDUCTOR LTD.

发明人： Mankyo JONG ,  Changyoung PARK

IPC分类号： H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

摘要： In a general aspect, a circuit assembly apparatus can include first and second semiconductor die, and a substrate. The substrate can include an insulating layer; a first metal layer disposed on a first side of the insulating layer, a first side of the first semiconductor die disposed on and electrically coupled with the first metal layer; a second metal layer disposed on a second side of the insulating layer, the second side of the insulating layer being opposite the first side of the insulating layer, a first side of the second semiconductor die being disposed on and electrically coupled with the second metal layer; and a conductive via disposed through the insulating layer, the conductive via electrically coupling the first metal layer with the second metal layer, the first metal layer, the conductive via and the second metal layer electrically coupling the first semiconductor die with the second semiconductor die.

公开(公告)号：US20180122725A1

公开(公告)日：2018-05-03

申请号：US15729973

申请日：2017-10-11

申请人： FAIRCHILD KOREA SEMICONDUCTOR LTD.

发明人： Seungwon IM ,  Mankyo JONG ,  Joonseo SON ,  Oseob JEON

IPC分类号： H01L23/495 ,  H01L23/40 ,  H01L23/38

摘要： In a general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate. The apparatus can include a conductive clip coupled to the semiconductor die. The leadframe can be disposed between the semiconductor die and the substrate, and the semiconductor die can be disposed between the conductive clip and the leadframe.