公开(公告)号：US10179751B2

公开(公告)日：2019-01-15

申请号：US15565288

申请日：2016-03-31

申请人： Evonik Degussa GmbH

发明人： Matthias Geisler ,  Frank Menzel

IPC分类号： C04B41/00 ,  C04B30/02 ,  C04B41/45 ,  C04B41/49 ,  C04B41/60 ,  C04B41/64

摘要： A process for producing an ammonia-treated hydrophilic thermal insulation molding which includes treating a thermal insulation molding containing hydrophilic silica with ammonia by introducing the thermal insulation molding into a chamber and supplying gaseous ammonia until a pressure difference Δp of ≥20 mbar is achieved. A process for producing a thermal insulation molding containing hydrophobic silica which includes treating the ammonia-treated hydrophilic thermal insulation molding with an organosilicon compound.