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1.发明授权Method for cohesively bonding metal to a non-metallic substrate using capacitors 有权使用电容器将金属粘附到非金属基底上的方法公开(公告)号：US08397976B2
公开(公告)日：2013-03-19
申请号：US13462926
申请日：2012-05-03
CPC分类号： B23K20/10 , B23K2103/04 , B23K2103/05 , B23K2103/14 , B29C65/081 , B29C65/645 , B29C66/1122 , B29C66/30321 , B29C66/3034 , B29C66/45 , B29C66/721 , B29C66/7212 , B29C66/72143 , B29C66/73161 , B29C66/742 , B29K2105/124 , B29K2309/08 , B29K2307/00 , B29K2277/00 , B29K2305/00
摘要： A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.
摘要翻译： 提供了一种用于金属表面和非金属基底之间的粘结的方法。 非金属基底可以包括分散在基底表面中和下方的多个微丝和/或纳米丝。 压力和侧向取向的高频和低振幅振动的应用可能允许金属表面和纳米丝的材料之间的扩散结合。 另一种方法包括从一组电容器排出能量以熔化金属表面和非金属基底的相邻表面。 另外，内聚键合方法还可以包括将超声波频率的电振荡转换成超声波振动，所述超声波振动传递到金属体和/或基底以将两种材料熔合在一起。
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公开(公告)号：US08186566B2
公开(公告)日：2012-05-29
申请号：US12045347
申请日：2008-03-10
CPC分类号： B23K20/10 , B23K2103/04 , B23K2103/05 , B23K2103/14 , B29C65/081 , B29C65/645 , B29C66/1122 , B29C66/30321 , B29C66/3034 , B29C66/45 , B29C66/721 , B29C66/7212 , B29C66/72143 , B29C66/73161 , B29C66/742 , B29K2105/124 , B29K2309/08 , B29K2307/00 , B29K2277/00 , B29K2305/00
摘要： A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.
摘要翻译： 提供了一种用于金属表面和非金属基底之间的粘结的方法。 非金属基底可以包括分散在基底表面中和下方的多个微丝和/或纳米丝。 压力和侧向取向的高频和低振幅振动的应用可能允许金属表面和纳米丝的材料之间的扩散结合。 另一种方法包括从一组电容器排出能量以熔化金属表面和非金属基底的相邻表面。 另外，内聚键合方法还可以包括将超声波频率的电振荡转换成超声波振动，所述超声波振动传递到金属体和/或基底以将两种材料熔合在一起。
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公开(公告)号：US20120273125A1
公开(公告)日：2012-11-01
申请号：US13462926
申请日：2012-05-03
IPC分类号： B32B37/06
CPC分类号： B23K20/10 , B23K2103/04 , B23K2103/05 , B23K2103/14 , B29C65/081 , B29C65/645 , B29C66/1122 , B29C66/30321 , B29C66/3034 , B29C66/45 , B29C66/721 , B29C66/7212 , B29C66/72143 , B29C66/73161 , B29C66/742 , B29K2105/124 , B29K2309/08 , B29K2307/00 , B29K2277/00 , B29K2305/00
摘要： A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.
摘要翻译： 提供了一种用于金属表面和非金属基底之间的粘结的方法。 非金属基底可以包括分散在基底表面中和下方的多个微丝和/或纳米丝。 压力和侧向取向的高频和低振幅振动的应用可能允许金属表面和纳米丝的材料之间的扩散结合。 另一种方法包括从一组电容器排出能量以熔化金属表面和非金属基底的相邻表面。 另外，内聚键合方法还可以包括将超声波频率的电振荡转换成超声波振动，所述超声波振动传递到金属体和/或基底以将两种材料熔合在一起。
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公开(公告)号：US20080217379A1
公开(公告)日：2008-09-11
申请号：US12045347
申请日：2008-03-10
IPC分类号： B23K31/02
CPC分类号： B23K20/10 , B23K2103/04 , B23K2103/05 , B23K2103/14 , B29C65/081 , B29C65/645 , B29C66/1122 , B29C66/30321 , B29C66/3034 , B29C66/45 , B29C66/721 , B29C66/7212 , B29C66/72143 , B29C66/73161 , B29C66/742 , B29K2105/124 , B29K2309/08 , B29K2307/00 , B29K2277/00 , B29K2305/00
摘要： A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.
摘要翻译： 提供了一种用于金属表面和非金属基底之间的粘结的方法。 非金属基底可以包括分散在基底表面中和下方的多个微丝和/或纳米丝。 压力和侧向取向的高频和低振幅振动的应用可能允许金属表面和纳米丝的材料之间的扩散结合。 另一种方法包括从一组电容器排出能量以熔化金属表面和非金属基底的相邻表面。 另外，内聚键合方法还可以包括将超声波频率的电振荡转换成超声波振动，所述超声波振动传递到金属体和/或基底以将两种材料熔合在一起。
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