公开(公告)号：US20230294979A1

公开(公告)日：2023-09-21

申请号：US17695889

申请日：2022-03-16

申请人： Enplas Corporation

发明人： Ken KITAMOTO ,  Ryoya NAKAMURA

IPC分类号： B81C1/00

CPC分类号： B81C1/00071 ,  B81C2201/034

摘要： A manufacturing method capable of manufacturing a laminate including a substrate having a recess and a film with a high yield is provided. The method of manufacturing a laminate of the present invention includes: preparing a substrate having a recess; disposing a film on the substrate so as to cover the recess; and obtaining a laminate by thermocompression bonding between the film and the substrate by pressing the film and the substrate with a first elastic body and a second elastic body in a state in which the substrate on which the film is disposed is disposed between the first elastic body and the second elastic body such that the film is on the first elastic body side, in which the first elastic body is harder than the second elastic body.