公开(公告)号：US20250076601A1

公开(公告)日：2025-03-06

申请号：US18765891

申请日：2024-07-08

Applicant: Electronics and Telecommunications Research Institute

Inventor： Won-Bae KWON ,  Eun Kyu KANG ,  Jong Jin LEE ,  Soo Yong JUNG ,  Haechung KANG ,  Myunghwan KIM ,  Dae Woong MOON ,  Gye Sul CHO

IPC: G02B6/43 ,  G02B6/42 ,  H04B10/40 ,  H05K1/02

Abstract: An optical receiving module assembly is provided. The optical receiving module assembly includes an electric sub-assembly including a printed circuit board (PCB) including an opening portion and an electronic device mounted on the PCB and an optical receiving module including a first optical component mounted on the PCB and a second optical component mounted on the mount which includes a transparent material and is disposed in the opening portion, wherein the electronic device and the second optical component are electrically connected to each other by a mount electrode formed on a surface of the mount.

公开(公告)号：US20250158349A1

公开(公告)日：2025-05-15

申请号：US18827421

申请日：2024-09-06

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Eun Kyu KANG ,  Haechung KANG ,  Jong Jin LEE ,  Won-Bae KWON ,  Soo Yong JUNG ,  Sangjin KWON ,  Myunghwan KIM

IPC: H01S5/02253 ,  H01S5/02251 ,  H01S5/02315 ,  H01S5/40

Abstract: Provided is a lens curing device for a multi-channel optical module, which cures a lens after arranging the lens on multiple axes between a laser diode and an optical waveguide of the optical module for each channel, the lens curing device including a vacuum collet that picks up the lens, a driver that moves the vacuum collet that picks up the lens and disposes the moved vacuum collet at an arrangement position of a submount, and an optical fiber that is embedded in at least a portion of the vacuum collet while connected to an ultraviolet (UV) light source in a preset wavelength band and transmits light radiated from the UV light source to a UV epoxy applied to a lower end of the lens.

公开(公告)号：US20250093599A1

公开(公告)日：2025-03-20

申请号：US18883663

申请日：2024-09-12

Applicant: Electronics and Telecommunications Research Institute

Inventor： Won-Bae KWON ,  Eun Kyu KANG ,  Jong Jin LEE ,  Soo Yong JUNG ,  Haechung KANG ,  Sangjin KWON ,  Myunghwan KIM

IPC: G02B6/42

Abstract: An optical module assembly is provided. The optical module assembly includes an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer.