公开(公告)号：US20250070089A1

公开(公告)日：2025-02-27

申请号：US18750090

申请日：2024-06-21

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Suk Yang ,  Myung Lae Lee ,  Jengsu Yoo ,  Yoonsik Yi

IPC: H01L25/065 ,  H01L25/00

Abstract: Provided are a 3-dimensional electronic device and a method for manufacturing the 3-dimensional electronic device. The method includes coupling semiconductor chips and guide blocks onto a substrate, forming an upper mold layer and upper wires on the semiconductor chips and the guide blocks by using a 3D printing method, stacking substrates other than the substrate on the upper mold layer and the upper wires, sawing a portion of each of the guide blocks and the upper mold layer, and forming a side mold layer and side wires on sidewalls of via electrodes of the guide blocks by using the 3D printing method.