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公开(公告)号:US20240350847A1
公开(公告)日:2024-10-24
申请号:US18136171
申请日:2023-04-18
申请人: Douglas Maddox
发明人: Douglas Maddox
IPC分类号: A62C37/40
CPC分类号: A62C37/40
摘要: A fire suppression apparatus for suppressing a fire in a room includes a housing which attaches to a surface and houses a container filled with a pressurized fire suppressant. A fire sensor monitors a room for one of a presence of a flame or a temperature above a threshold temperature. When either the presence of a flame is or the temperature above the threshold temperature is detected, a timer is started by a control circuit, which then releases the fire suppressant after the timer reaches a predetermined time period. A reset input is provided for terminating the timer and preventing the release of the fire suppressant.
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2.
公开(公告)号:US20070038967A1
公开(公告)日:2007-02-15
申请号:US11585370
申请日:2006-10-24
申请人: Nicholas Brathwaite , Ram Bommakanti , Visvanathan Ganapathy , Paul Burns , Douglas Maddox , Michael Durkan
发明人: Nicholas Brathwaite , Ram Bommakanti , Visvanathan Ganapathy , Paul Burns , Douglas Maddox , Michael Durkan
IPC分类号: G06F17/50
CPC分类号: G06F17/5081 , G06F17/50 , G06F17/5045 , G06F2217/00 , G06F2217/04 , G06F2217/74 , G06Q90/00 , G06Q99/00
摘要: A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.
摘要翻译: 一种用于设计电子部件的方法包括从设计者接收设备标准(例如,参数值,采购价值等),向数据库查询对应于设备标准的设备,查询数据库以获取采购数据和/或工程 与相应设备相关联的数据,基于采购数据将设备呈现给设计者,以及从设计者接收将所呈现设备中的一个标识为所选设备的输入。 在特定方法中,返回的设备基于一个或多个采购值(例如,制造商,价格,可用性,制造商状态等)进行排序,并以排名列表呈现给设计者。 然后将所选设备的代表物体输入到设计文件中,并且对象与设备的工程和/或采购数据相关联。 在特定实施例中,通过将工程数据嵌入文件对象中,对象与工程数据相关联。 可选地,数据可以通过到数据库的链接与对象相关联。 可以与设计文件对象相关联的工程数据的类型包括但不限于设备占用空间数据,设备引脚数据,设备物理尺寸数据,参数数据和打包数据。 另外,连接数据和注释数据可以由设计者输入设计文件对象。
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