公开(公告)号：US20230125969A1

公开(公告)日：2023-04-27

申请号：US18048450

申请日：2022-10-21

申请人： Delta Electronics (Thailand) Public Co., Ltd.

发明人： Hugues NJIENDE ,  Eugen SCHWAN ,  Sergey TIKHONOV

IPC分类号： H01F41/00 ,  H01F27/02 ,  H01F27/08

摘要： The present disclosure concerns a method of manufacturing an electronic device, where the electronic device includes at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, and the method includes inserting the at least one electronic component into a cavity; pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; removing the electronic device, namely, the electronic component covered by the heat dissipation mass coating, from the cavity. The present disclosure also concerns an electronic apparatus including at least one electronic device manufactured by the foregoing method.