公开(公告)号：US20180163100A1

公开(公告)日：2018-06-14

申请号：US15111976

申请日：2015-03-24

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Andreas A Lutz ,  Benjamin Alexander Haag ,  Beda Steiner

IPC: C09J163/00 ,  C09J11/08

CPC classification number: C09J163/00 ,  C08G59/245 ,  C08L63/00 ,  C09J11/08 ,  C08L51/04 ,  C08L75/04

Abstract: The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.