公开(公告)号：US10563870B2

公开(公告)日：2020-02-18

申请号：US15316196

申请日：2015-07-07

Applicant: DENSO CORPORATION

Inventor： Kimitake Ishikawa ,  Hideaki Kako ,  Hiroyasu Oide ,  Hideki Seki ,  Yoshinobu Sumida ,  Yasuhiro Sagou

IPC: H05B3/20 ,  F24C7/04 ,  B60H1/22 ,  F24D13/02 ,  G06F3/041

Abstract: A radiation heating device includes: a planar heat generation layer; a heat generation portion that is provided in the heat generation layer and that generates heat by energization; a plurality of heat radiation portions that are disposed in the heat generation layer and that radiate heat transferred from the heat generation portion; a low heat conduction portion that is provided around each of the heat radiation portions and that has a lower heat conductivity than the heat radiation portions; and a contact detection unit that detects contact of an object with the heat generation layer. The radiation heating device further includes an energization amount decrease unit that decreases an energization amount of the heat generation portion when the contact detection unit detects the contact of the object with the heat generation layer.