公开(公告)号：US09955610B2

公开(公告)日：2018-04-24

申请号：US15250222

申请日：2016-08-29

申请人： DELTA ELECTRONICS, INC.

发明人： Chih-Chi Wu ,  I-Shen Lin

IPC分类号： H05K7/20 ,  H01L23/40 ,  H01L23/367

CPC分类号： H05K7/20436 ,  H01L23/3675 ,  H01L23/4093

摘要： A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.