公开(公告)号：US10825483B2

公开(公告)日：2020-11-03

申请号：US16243903

申请日：2019-01-09

申请人： DELL PRODUCTS, L.P.

发明人： Haifang Zhai ,  Hendry Wu ,  David Dong ,  Yujie Zhou

IPC分类号： G11B33/14 ,  H05K7/20

摘要： Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.