公开(公告)号：US10939587B2

公开(公告)日：2021-03-02

申请号：US15434946

申请日：2017-02-16

申请人： DELL PRODUCTS, L P

发明人： Robert Boyd Curtis ,  Austin M. Shelnutt

IPC分类号： H05K7/20

摘要： A cooling system for a server rack may cool one or more servers and one or more components thereof. The cooling system may comprise an air mover, an air delivery manifold, and one or more injection ducts for the one or more servers. The air mover may be located in an air mover module positioned in the server rack and may generate a pressurized airflow. The air delivery manifold receives the pressurized airflow generated by the air mover, and may have delivery ports and provide a fluid path for airflow out of the delivery ports to the injection ducts. The injection ducts may be used to inject the airflow of cooling air into the servers to cool the servers and one or more components thereof.