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公开(公告)号：US09908486B2
公开(公告)日：2018-03-06
申请号：US15256955
申请日：2016-09-06
发明人： Makoto Suzuki , Yuusuke Ito , Yousuke Ogino , Kentaro Furuki
CPC分类号： B60R16/0215 , H01B13/01209 , H01R43/24 , H02G3/30 , H02G3/32
摘要： An objective is to provide a manufacturing method and a manufacturing device for a wire harness, and the wire harness and a retention component manufactured thereby, the wire harness including a wiring bundle, a retention portion configured to retain the wiring bundle, and an engagement portion to be attached to a vehicle body, the manufacturing method and the manufacturing device being capable of efficiently manufacturing the wire harness and being applicable to engagement portions having different shapes.
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公开(公告)号：US10343626B2
公开(公告)日：2019-07-09
申请号：US15076735
申请日：2016-03-22
发明人： Kouji Kamiya , Yuusuke Ito , Makoto Suzuki , Hiroaki Suzuki , Kentaro Furuki , Masanari Ichihara
摘要： An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness.A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.
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