公开(公告)号：US10886506B2

公开(公告)日：2021-01-05

申请号：US15561704

申请日：2016-03-30

申请人： DAI NIPPON PRINTING CO., LTD.

发明人： Kaoru Miyazaki ,  Hirotoshi Sakamoto ,  Yousuke Hayakawa ,  Rikiya Yamashita ,  Takanori Yamashita ,  Tsuyoshi Suzuki ,  Yoichi Mochizuki ,  Kazuhiko Yokota ,  Tetsuya Ojiri

IPC分类号： H01M2/00 ,  H01M2/02 ,  H01G11/78 ,  H01G11/80

摘要： Provided is a cell packaging material having a high insulating performance and durability. A cell packaging material comprising a layered body provided with at least a substrate layer, a metal layer, an adhesive layer, and a heat-fusible resin layer in the stated order. The adhesive layer has a resin composition that contains an acid-modified polyolefin and an epoxy resin. In probe displacement amount measurements involving the use of a thermal mechanical analyzer, when a probe is placed on the surface of the adhesive layer at an end part of the cell packaging material and the probe is heated from 40° C. to 220° C., the position of the probe does not drop in relation to the initial value.