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公开(公告)号:US20230354946A1
公开(公告)日:2023-11-09
申请号:US18357017
申请日:2023-07-21
Applicant: Cricut, Inc.
Inventor: Kristy Lynn Barney , Mitchell Alan Cheever , Yung Tseng Chen , Thomas Crisp , John Douglas Dalton , Michelle Fishberg , Kelton Gubler , Desmond Kavanagh , Hayley Ketch , Tyler Lee , Ildefonso M. Resuello, JR. , Norman Stevenson , Grayson Stopp
CPC classification number: A42C1/08 , B41F16/02 , B30B9/00 , B30B15/064 , D06F75/08 , D06F79/02 , B32B37/06
Abstract: A heat press includes a handle portion and a curved heat plate. That handle portion may be configured to be grasped by a user, and the curved heat (i.e., having a curved engagement surface) may be configured to engage a heat-activated design implement to transfer a design of the heat-activated design implement to a curved surface of a workpiece. Also disclosed herein, according to various embodiments, is a heat press stand having a curved floor and a hat form for supporting a workpiece (e.g., a hat) during a heat-activated design transfer using the heat press. Associated methods are also disclosed herein.
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公开(公告)号:US11707104B1
公开(公告)日:2023-07-25
申请号:US17653464
申请日:2022-03-03
Applicant: Cricut, Inc.
Inventor: Kristy Lynn Barney , Mitchell Alan Cheever , Yung Tseng Chen , Thomas Crisp , John Douglas Dalton , Michelle Fishberg , Kelton Gubler , Desmond Kavanagh , Hayley Ketch , Tyler Lee , Ildefonso M. Resuello, Jr. , Norman Stevenson , Grayson Stopp
CPC classification number: A42C1/08 , B30B9/00 , B30B15/064 , B32B37/06 , B41F16/02 , D06F75/08 , D06F79/02
Abstract: A heat press includes a handle portion and a curved heat plate. That handle portion may be configured to be grasped by a user, and the curved heat (i.e., having a curved engagement surface) may be configured to engage a heat-activated design implement to transfer a design of the heat-activated design implement to a curved surface of a workpiece. Also disclosed herein, according to various embodiments, is a heat press stand having a curved floor and a hat form for supporting a workpiece (e.g., a hat) during a heat-activated design transfer using the heat press. Associated methods are also disclosed herein.
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