公开(公告)号：US20230017540A1

公开(公告)日：2023-01-19

申请号：US17949416

申请日：2022-09-21

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  William Miranda ,  William Rehak

IPC: H05K7/20

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

公开(公告)号：US11464134B2

公开(公告)日：2022-10-04

申请号：US16891130

申请日：2020-06-03

Applicant: Crestron Electronics Inc.

Inventor： Albert Pedoeem ,  William Miranda ,  William Rehak

IPC: H05K7/20

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

公开(公告)号：US10400937B2

公开(公告)日：2019-09-03

申请号：US16194423

申请日：2018-11-19

Applicant: Crestron Electronics, Inc.

Inventor： Howard Balch ,  Fred Bargetzi ,  Wendy Feldstein ,  Dhirendra Patel ,  Dan Previti ,  William Rehak ,  George Feldstein

IPC: F16M11/10 ,  F16M11/22 ,  F16B1/00

Abstract: An adjustable monitor stand that can hold a monitor includes a carrier, a base, and a low friction insert. First and second channel insertion portions extend from a curved lower surface of the low friction insert. Each has outer walls to be received by and fixedly engage with first and second base channels formed in a curved upper surface of the base, respectively, to prevent movement of the low friction insert with respect to the base. The first and second channel insertion portions each have inner walls to receive first and second protrusions extending from a curved lower surface of the carrier, respectively, and permit the carrier to be moved about a non-vertical axis as the first and second protrusions slide along the inner walls. The first and second protrusions of the carrier also form a frictional engagement with the inner walls of the first and second channel insertion portions.

公开(公告)号：US11963329B2

公开(公告)日：2024-04-16

申请号：US17949416

申请日：2022-09-21

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  William Miranda ,  William Rehak

IPC: H05K7/20

CPC classification number: H05K7/20145

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

公开(公告)号：USD834565S1

公开(公告)日：2018-11-27

申请号：US29583968

申请日：2016-11-10

Applicant: Crestron Electronics, Inc.

Designer： Joseph Sarrasin ,  Wendy Feldstein ,  William Rehak ,  Howie Balch ,  Andre Poulheim ,  Johannes Martin Ott

公开(公告)号：US20240260225A1

公开(公告)日：2024-08-01

申请号：US18633819

申请日：2024-04-12

Applicant: Crestron Electronics Inc.

Inventor： Albert Pedoeem ,  William Miranda ,  William Rehak

IPC: H05K7/20

CPC classification number: H05K7/20145

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

公开(公告)号：US20170354060A1

公开(公告)日：2017-12-07

申请号：US15602334

申请日：2017-05-23

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  William Miranda ,  William Rehak

IPC: H05K7/20

CPC classification number: H05K7/20145

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

公开(公告)号：USD726164S1

公开(公告)日：2015-04-07

申请号：US29504174

申请日：2014-10-02

Applicant: Crestron Electronics, Inc.

Designer： Wendy Feldstein ,  King-Woo Cheung ,  William Rehak ,  Dhirendra Patel ,  Kian-Mun Kong

公开(公告)号：USD953279S1

公开(公告)日：2022-05-31

申请号：US29764022

申请日：2020-12-28

Applicant: Crestron Electronics, Inc.

Designer： William Rehak ,  Sae Jhun ,  Wendy Feldstein

公开(公告)号：USD934807S1

公开(公告)日：2021-11-02

申请号：US29619288

申请日：2017-09-28

Applicant: Crestron Electronics, Inc.

Designer： William Rehak ,  Albert Pedoeem ,  Connie Gelsomino ,  Marc Eric Johnson