公开(公告)号：US11076501B2

公开(公告)日：2021-07-27

申请号：US16534398

申请日：2019-08-07

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

公开(公告)号：USD1069755S1

公开(公告)日：2025-04-08

申请号：US29859350

申请日：2022-11-09

Applicant: Crestron Electronics, Inc.

Designer： Howard Balch ,  Sae Jhun ,  Don Florczak

公开(公告)号：USD778245S1

公开(公告)日：2017-02-07

申请号：US29559337

申请日：2016-03-28

Applicant: Crestron Electronics, Inc.

Designer： Wendy Feldstein ,  Howard Balch ,  Sae Jhun ,  Don Florczak

公开(公告)号：US20200008317A1

公开(公告)日：2020-01-02

申请号：US16534398

申请日：2019-08-07

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

公开(公告)号：USD778244S1

公开(公告)日：2017-02-07

申请号：US29559335

申请日：2016-03-28

Applicant: Crestron Electronics, Inc.

Designer： Wendy Feldstein ,  Howard Balch ,  Sae Jhun ,  Don Florczak

公开(公告)号：USD1066290S1

公开(公告)日：2025-03-11

申请号：US29859336

申请日：2022-11-09

Applicant: Crestron Electronics, Inc.

Designer： Howard Balch ,  Sae Jhun ,  Don Florczak

公开(公告)号：USD1051067S1

公开(公告)日：2024-11-12

申请号：US29826059

申请日：2022-02-09

Applicant: Crestron Electronics, Inc.

Designer： Howard Balch ,  Sae Jhun ,  Don Florczak

公开(公告)号：US11683907B2

公开(公告)日：2023-06-20

申请号：US17375045

申请日：2021-07-14

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20145 ,  H05K7/20445

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

公开(公告)号：USD981994S1

公开(公告)日：2023-03-28

申请号：US29781973

申请日：2021-05-03

Applicant: Crestron Electronics, Inc.

Designer： Wendy Feldstein ,  Sae Jhun ,  Howie Balch ,  Don Florczak ,  Chetan Khanna ,  Gautham Basti

公开(公告)号：US20210345521A1

公开(公告)日：2021-11-04

申请号：US17375045

申请日：2021-07-14

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.