Wafer-level lens structure for contact image sensor module

    公开(公告)号:US09780133B2

    公开(公告)日:2017-10-03

    申请号:US14817294

    申请日:2015-08-04

    Inventor: Ming-Chieh Lin

    CPC classification number: H01L27/14627 G02B3/005 G02B13/0085

    Abstract: A wafer-level lens structure for contact image sensor (CIS) module includes a printed circuit board (PCB) and an image sensor electrically connected to the PCB and comprising a circuit area and a light sensitive area. The light sensitive area comprises an optoelectronic conversion array, a first lens array arranged on the optoelectronic conversion array and comprising a plurality of first cover lens, each of first cover lens having a first curved face to focus the external image light to the optoelectronic conversion array, and an aperture array arranged on the first lens array and comprising a plurality of apertures to expose the first curved face, the aperture array controlling a light amount passing through the cover lens. The first curved face of the cover lens has such a curvature that a predetermined focus point can be achieved by the plurality of first cover lens.

    Contact image sensing device
    2.
    发明授权
    Contact image sensing device 有权
    联系图像传感装置

    公开(公告)号:US09036220B2

    公开(公告)日:2015-05-19

    申请号:US14157072

    申请日:2014-01-16

    CPC classification number: H04N1/02855 H04N1/0286 H04N1/10

    Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess. The main body of the protecting member forms at least one containing recess. A combining component for combining the rod lens array and the protecting member is disposed within the containing recess.

    Abstract translation: 接触图像感测装置包括壳体,发光单元,红色透镜阵列,感测单元和保护部件。 壳体包括顶表面,底表面,容纳槽和槽。 底面与顶面相反。 容纳槽形成在顶面上并朝向底面凹陷。 槽穿过顶面和底面。 发光单元布置在容纳槽内。 棒状透镜阵列布置在槽内。 感测单元布置在外壳下方。 保护部件包括主体,凹部和与凹部连通的照明槽,杆状透镜阵列的顶端与凹部组装。 保护构件的主体形成至少一个容纳凹部。 用于组合棒状透镜阵列和保护构件的组合部件设置在容纳凹部内。

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