公开(公告)号：US20170040370A1

公开(公告)日：2017-02-09

申请号：US14817294

申请日：2015-08-04

Applicant: Creative Sensor Inc.

Inventor： Ming-Chieh LIN

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  G02B3/005 ,  G02B13/0085

Abstract: A wafer-level lens structure for contact image sensor (CIS) module includes a printed circuit board (PCB) and an image sensor electrically connected to the PCB and comprising a circuit area and a light sensitive area. The light sensitive area comprises an optoelectronic conversion array, a first lens array arranged on the optoelectronic conversion array and comprising a plurality of first cover lens, each of first cover lens having a first curved face to focus the external image light to the optoelectronic conversion array, and an aperture array arranged on the first lens array and comprising a plurality of apertures to expose the first curved face, the aperture array controlling a light amount passing through the cover lens. The first curved face of the cover lens has such a curvature that a predetermined focus point can be achieved by the plurality of first cover lens.

Abstract translation: 用于接触图像传感器（CIS）模块的晶片级透镜结构包括印刷电路板（PCB）和电连接到PCB并包括电路区域和光敏区域的图像传感器。 光敏区域包括光电转换阵列，布置在光电转换阵列上的第一透镜阵列，并且包括多个第一盖透镜，每个第一盖透镜具有第一弯曲面以将外部图像光聚焦到光电转换阵列 以及孔径阵列，其布置在所述第一透镜阵列上并且包括多个孔以暴露所述第一弯曲面，所述孔径阵列控制通过所述覆盖透镜的光量。 盖透镜的第一弯曲面具有这样的曲率，即可以通过多个第一盖透镜来实现预定的聚焦点。

公开(公告)号：US20150070735A1

公开(公告)日：2015-03-12

申请号：US14157072

申请日：2014-01-16

Applicant: Creative Sensor Inc.

Inventor： Ting-Pin LU ,  Ming-Chieh LIN ,  Jia-Lin LEE

IPC: H04N1/028 ,  H04N1/10

CPC classification number: H04N1/02855 ,  H04N1/0286 ,  H04N1/10

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess.

Abstract translation: 接触图像感测装置包括壳体，发光单元，红色透镜阵列，感测单元和保护部件。 壳体包括顶表面，底表面，容纳槽和槽。 底面与顶面相反。 容纳槽形成在顶面上并朝向底面凹陷。 槽穿过顶面和底面。 发光单元布置在容纳槽内。 棒状透镜阵列布置在槽内。 感测单元布置在外壳下方。 保护部件包括主体，凹部和与凹部连通的照明槽，杆状透镜阵列的顶端与凹部组装。