公开(公告)号：US20200349983A1

公开(公告)日：2020-11-05

申请号：US16398861

申请日：2019-04-30

Applicant: Cisco Technology, Inc.

Inventor： Hoi San Leung ,  Steve Zhijian Chen ,  Richard Jiang Li ,  Minh-Thanh T. Vo ,  Shameem Ahmed ,  Kenny Lieu

IPC: G11C5/04 ,  G11C5/06 ,  H05K1/18

Abstract: In one embodiment, a printed circuit board (PCB) has a first central processing unit (CPU) socket and a second CPU socket substantially in line with the first CPU socket, and also has a first plurality of dual in-line memory module (DIMM) sockets interconnected with the first CPU socket and a second plurality of DIMM sockets interconnected with the second CPU socket (in a direction parallel to the first plurality of DIMM sockets). The first plurality of DIMM sockets are arranged on the PCB in at least a first column and a second column of DIMM sockets, and the second plurality of DIMM sockets are arranged on the PCB in at least the second column and a third column of DIMM sockets, such that the second column of DIMM sockets contains interleaved DIMM sockets from each of the first plurality of DIMM sockets and the second plurality of DIMM sockets.

公开(公告)号：US11004476B2

公开(公告)日：2021-05-11

申请号：US16398861

申请日：2019-04-30

Applicant: Cisco Technology, Inc.

Inventor： Hoi San Leung ,  Steve Zhijian Chen ,  Richard Jiang Li ,  Minh-Thanh T. Vo ,  Shameem Ahmed ,  Kenny Lieu

IPC: G11C5/04 ,  G11C5/06 ,  H05K1/18 ,  G06F30/392 ,  G06F30/394

Abstract: In one embodiment, a printed circuit board (PCB) has a first central processing unit (CPU) socket and a second CPU socket substantially in line with the first CPU socket, and also has a first plurality of dual in-line memory module (DIMM) sockets interconnected with the first CPU socket and a second plurality of DIMM sockets interconnected with the second CPU socket (in a direction parallel to the first plurality of DIMM sockets). The first plurality of DIMM sockets are arranged on the PCB in at least a first column and a second column of DIMM sockets, and the second plurality of DIMM sockets are arranged on the PCB in at least the second column and a third column of DIMM sockets, such that the second column of DIMM sockets contains interleaved DIMM sockets from each of the first plurality of DIMM sockets and the second plurality of DIMM sockets.