Masks that selectively attentuate radiation for inspection of printed circuit boards

    公开(公告)号:US09869643B2

    公开(公告)日:2018-01-16

    申请号:US14163756

    申请日:2014-01-24

    Abstract: Masks that selectively attenuate radiation for inspections of printed circuit boards (PCB) are disclosed. A PCB may be inspected for defects by exposing the PCB with radiation and analyzing the radiation transmitted through the PCB. By employing a radiation mask having first and second segments between the PCB and a radiation source, the radiation may be selectively attenuated to attenuate a first portion of the radiation with a first attenuation level to prevent performance degradation to sensitive semiconductor devices as part of a first sectional area of the PCB, and yet provide substantially non-attenuation or attenuation at a second attenuation level for a second portion of the radiation incident upon a second sectional area of the PCB which is free from sensitive semiconductor devices. In this manner, the selective attenuation enables inspection of the first and second sectional areas of the PCB without damage to the sensitive semiconductor devices.

    Hardware device temperature control with expected lifetime calculation

    公开(公告)号:US11762380B2

    公开(公告)日:2023-09-19

    申请号:US17813692

    申请日:2022-07-20

    CPC classification number: G05B23/0283 G05B23/0232 H05K7/20836

    Abstract: Embodiments herein describe coupling traditional fan and shaper control along with aggregated knowledge of the temperature history of a hardware device to optimally manage the temperature of the hardware device to preserve its expected life while also providing the lower power, best performing solution possible. In one embodiment, a cooling application manages the expected life by trading off performance and power versus temperature to achieve a desired (or accepted) lifetime. In one embodiment, the cooling application calculates a historical temperature value for the hardware device which is then used to determine the expected life of the hardware device.

    Hardware device temperature control with expected lifetime calculation

    公开(公告)号:US11429093B2

    公开(公告)日:2022-08-30

    申请号:US16723882

    申请日:2019-12-20

    Abstract: Embodiments herein describe coupling traditional fan and shaper control along with aggregated knowledge of the temperature history of a hardware device to optimally manage the temperature of the hardware device to preserve its expected life while also providing the lower power, best performing solution possible. In one embodiment, a cooling application manages the expected life by trading off performance and power versus temperature to achieve a desired (or accepted) lifetime. In one embodiment, the cooling application calculates a historical temperature value for the hardware device which is then used to determine the expected life of the hardware device.

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