公开(公告)号：US20240426676A1

公开(公告)日：2024-12-26

申请号：US18341543

申请日：2023-06-26

Applicant: Cisco Technology, Inc.

Inventor： Sujit HANDANHAL RAMACHANDRA ,  Abhishek BHAT ,  Prajwal M. KASTURI

IPC: G01K7/18 ,  G02F1/01 ,  H04B10/40

Abstract: The present disclosure describes systems and methods for detecting temperature in an electro-optical circuit (e.g., an electro-optical transceiver). According to an embodiment, an electro-optical circuit includes a photonic integrated circuit and an electronic integrated circuit. The photonic integrated circuit includes an optical component and a first resistor positioned by the optical component. The electronic integrated circuit determines a temperature for the optical component based on a first resistance of the first resistor.

公开(公告)号：US20210382106A1

公开(公告)日：2021-12-09

申请号：US17445616

申请日：2021-08-23

Applicant: Cisco Technology, Inc.

Inventor： Sanjay SUNDER ,  Prajwal M. KASTURI ,  Joseph V. PAMPANIN ,  Craig S. APPEL

IPC: G01R31/28

Abstract: The fault detection system described provides an efficient method to test and monitor component to component connectivity in an electronic package using on chip test circuits and on chip components, which reduces the need for external testing equipment and analysis. The on chip nature allows for both real time testing in the assembly process of the electronic packages and during use of the electronic package by determining an on chip reference measurement and using the reference measurement to determine an operational status of the package.