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公开(公告)号:US20210231891A1
公开(公告)日:2021-07-29
申请号:US17231594
申请日:2021-04-15
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer , Theodor Kupfer , Viktor Brauer
IPC: G02B6/42 , H01R13/514 , H01R43/26
Abstract: In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.
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公开(公告)号:US20230026423A1
公开(公告)日:2023-01-26
申请号:US17381694
申请日:2021-07-21
Applicant: Cisco Technology, Inc.
Inventor: Christian Rainer Raabe , Michael Tittenhofer , Theodor Kupfer
IPC: H01S5/024 , H01L23/367 , H01S5/0234 , H01S5/02345
Abstract: Presented herein are a submount architecture for an electro-optical engine, which may be embodied as an apparatus in the form of at least an electro-optical engine and a multimode node, and a method for providing the same. According to at least one example, an apparatus includes a printed circuit board (PCB), a substrate with a finer structuring than the PCB, and electro-optical components. A bottom surface of the substrate is coupled to the PCB and electro-optical components are mounted on a top surface of the substrate. The electro-optical components include one or more optical components arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate.
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公开(公告)号:US20200145107A1
公开(公告)日:2020-05-07
申请号:US16674072
申请日:2019-11-05
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer
Abstract: A host card is provided for supplying power to a transceiver module through a transceiver interface. The host card established a connection of the transceiver module with the transceiver interface. The transceiver module is operable in a low power mode and a high power mode. The host card requests module identification information from the transceiver module. In response to receiving the module identification information, the host hard verifies a module power condition and modifies an output voltage provided by a primary host power supply if the module power condition is verified.
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公开(公告)号:US10826612B2
公开(公告)日:2020-11-03
申请号:US16674072
申请日:2019-11-05
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer
Abstract: A host card is provided for supplying power to a transceiver module through a transceiver interface. The host card established a connection of the transceiver module with the transceiver interface. The transceiver module is operable in a low power mode and a high power mode. The host card requests module identification information from the transceiver module. In response to receiving the module identification information, the host hard verifies a module power condition and modifies an output voltage provided by a primary host power supply if the module power condition is verified.
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5.
公开(公告)号:US20200150366A1
公开(公告)日:2020-05-14
申请号:US16674568
申请日:2019-11-05
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer , Theodor Kupfer , Viktor Brauer
IPC: G02B6/42 , H01R13/514 , H01R43/26
Abstract: In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.
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公开(公告)号:US11112572B2
公开(公告)日:2021-09-07
申请号:US16591531
申请日:2019-10-02
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer , Theodor Kupfer , Viktor Brauer
Abstract: In one embodiment, a pluggable module for insertion into a socket of a network cabinet is disclosed, the pluggable module comprising a body having first and second portions arranged along an axis, wherein the module is arranged for insertion of the first portion into said socket in a direction of insertion along the axis, whereupon the second portion protrudes from said socket along the axis and away from the direction of insertion, and wherein the second portion comprises a first heat sink on a surface of the second portion, wherein the first heat sink comprises a plurality of parallel fins aligned with the axis of insertion.
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公开(公告)号:US11036017B2
公开(公告)日:2021-06-15
申请号:US16674568
申请日:2019-11-05
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer , Theodor Kupfer , Viktor Brauer
IPC: G02B6/42 , H01R13/514 , H01R43/26
Abstract: In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.
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公开(公告)号:US11573384B2
公开(公告)日:2023-02-07
申请号:US17231594
申请日:2021-04-15
Applicant: Cisco Technology, Inc.
Inventor: Michael Tittenhofer , Theodor Kupfer , Viktor Brauer
IPC: G02B6/42 , H01R13/514 , H01R43/26
Abstract: In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.
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公开(公告)号:US20230028883A1
公开(公告)日:2023-01-26
申请号:US17516847
申请日:2021-11-02
Applicant: Cisco Technology, Inc.
Inventor: Christian Rainer Raabe , Michael Tittenhofer , Theodor Kupfer
Abstract: Presented herein are a submount architecture for an electro-optical engine, which may be embodied as an apparatus in the form of at least an electro-optical engine and a multimode node, and a method for providing the same. According to at least one example, an apparatus includes a printed circuit board (PCB), a substrate with a finer structuring than the PCB, and electro-optical components. A bottom surface of the substrate is coupled to the PCB and electro-optical components are mounted on or in a top surface of the substrate. The electro-optical components include one or more optical components arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate.
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