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公开(公告)号:US20230239051A1
公开(公告)日:2023-07-27
申请号:US17585827
申请日:2022-01-27
Applicant: Cisco Technology, Inc.
Inventor: Gudipaty Vasanta Rao , Anjali Mysore Vijayakumar , Ratna Reddy Chada , Joanne Tse , Darja Padilla , Mark Charles Nowell
IPC: H04B10/40
CPC classification number: H04B10/40
Abstract: A method for optical transceiver misconnection identification that allows a simple low-level process to monitor and communicate optical transceiver characteristics information between two optical transceiver modules regardless of their transceiver type to determine if they are correctly connected or mismatched. If a mismatch is determined, the knowledge gained about the transceiver type of a far end module may be obtained (and presented to an installer) and used by an installer to select and install a module that is operationally compatible with the far end optical module.
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公开(公告)号:US20230388020A1
公开(公告)日:2023-11-30
申请号:US18447692
申请日:2023-08-10
Applicant: Cisco Technology, Inc.
Inventor: Gudipaty Vasanta Rao , Anjali Mysore Vijayakumar , Ratna Reddy Chada , Joanne Tse , Darja Padilla , Mark Charles Nowell
IPC: H04B10/40
CPC classification number: H04B10/40
Abstract: A method for optical transceiver misconnection identification that allows a simple low-level process to monitor and communicate optical transceiver characteristics information between two optical transceiver modules regardless of their transceiver type to determine if they are correctly connected or mismatched. If a mismatch is determined, the knowledge gained about the transceiver type of a far end module may be obtained (and presented to an installer) and used by an installer to select and install a module that is operationally compatible with the far end optical module.
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公开(公告)号:US20230075607A1
公开(公告)日:2023-03-09
申请号:US17841838
申请日:2022-06-16
Applicant: Cisco Technology, Inc.
Inventor: D. Brice Achkir , Jie Xue , Mark Charles Nowell
IPC: H01L25/16 , H01L23/538 , H01L23/498 , H01L21/48
Abstract: An apparatus is provided that includes a thin-film interconnect structure that comprises one or more polymeric layers and conductive plating, a first surface of the thin-film interconnect structure being configured to receive one or more dies, and a second surface of the thin-film interconnect structure being configured to receive a substrate. A method of assembling the apparatus into an integrated circuit assembly is also provided.
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公开(公告)号:US11777609B2
公开(公告)日:2023-10-03
申请号:US17585827
申请日:2022-01-27
Applicant: Cisco Technology, Inc.
Inventor: Gudipaty Vasanta Rao , Anjali Mysore Vijayakumar , Ratna Reddy Chada , Joanne Tse , Darja Padilla , Mark Charles Nowell
IPC: H04B10/40
CPC classification number: H04B10/40
Abstract: A method for optical transceiver misconnection identification that allows a simple low-level process to monitor and communicate optical transceiver characteristics information between two optical transceiver modules regardless of their transceiver type to determine if they are correctly connected or mismatched. If a mismatch is determined, the knowledge gained about the transceiver type of a far end module may be obtained (and presented to an installer) and used by an installer to select and install a module that is operationally compatible with the far end optical module.
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