公开(公告)号：US11940661B2

公开(公告)日：2024-03-26

申请号：US17554886

申请日：2021-12-17

Applicant: Cisco Technology, Inc.

Inventor： Joseph F. Jacques ,  Edward John Kliewer ,  Harrison S. Teplitz

IPC: H05K7/20 ,  G02B6/42 ,  H05K9/00

CPC classification number: G02B6/4269 ,  H05K7/20127 ,  H05K7/20518 ,  H05K9/0058 ,  H05K9/0015

Abstract: A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.

公开(公告)号：US20230194810A1

公开(公告)日：2023-06-22

申请号：US17554886

申请日：2021-12-17

Applicant: Cisco Technology, Inc.

Inventor： Joseph F. Jacques ,  Edward John Kliewer ,  Harrison S. Teplitz

IPC: G02B6/42 ,  F28D15/02 ,  F28F1/32

CPC classification number: G02B6/4269 ,  F28D15/0275 ,  F28F1/32

Abstract: A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.