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公开(公告)号:US20230010397A1
公开(公告)日:2023-01-12
申请号:US17644999
申请日:2021-12-17
Applicant: Cisco Technology, Inc.
Inventor: Mark C. NOWELL , D. Brice ACHKIR , Joel R. GOERGEN , Giovanni GIOBBIO , Mary K. LAUE
IPC: H01R12/72 , H01R13/6594
Abstract: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.
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公开(公告)号:US20220359366A1
公开(公告)日:2022-11-10
申请号:US17446729
申请日:2021-09-02
Applicant: Cisco Technology, Inc.
Inventor: Mike SAPOZHNIKOV , Sayed Ashraf MAMUN , Tomer OSI , Amendra KOUL , David NOZADZE , Upendranadh R. KARETI , Joel R. GOERGEN
IPC: H01L23/50 , H01L23/367 , H01L23/498
Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.
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公开(公告)号:US20220360005A1
公开(公告)日:2022-11-10
申请号:US17653466
申请日:2022-03-04
Applicant: Cisco Technology, Inc.
Inventor: Mike SAPOZHNIKOV , Sayed Ashraf MAMUN , Tomer OSI , Amendra KOUL , David NOZADZE , Upendranadh R. KARETI , Joel R. GOERGEN
Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.
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公开(公告)号:US20230178915A1
公开(公告)日:2023-06-08
申请号:US18163125
申请日:2023-02-01
Applicant: Cisco Technology, Inc.
Inventor: Mark C. NOWELL , D. Brice ACHKIR , Joel R. GOERGEN , Giovanni GIOBBIO , Mary K. LAUE
IPC: H01R12/72 , H01R13/6594
CPC classification number: H01R12/721 , H01R13/6594
Abstract: A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.
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公开(公告)号:US20230065681A1
公开(公告)日:2023-03-02
申请号:US17445999
申请日:2021-08-26
Applicant: Cisco Technology, Inc.
Inventor: Madhuri CHANDRASHEKHARAIAH , Rohit Dev GUPTA , Paolo SIRONI , Joel R. GOERGEN , Chad M. JONES , Jason D. POTTERF
Abstract: Embodiments presented in this disclosure generally relate to a ground device. More specifically, embodiments disclosed herein are directed to a grounding device for indicating whether there is proper grounding for electrical equipment. One embodiment presented in this disclosure provides an apparatus. The apparatus generally includes a lug configured to be coupled to a physical ground node, the lug having one or more bolts for coupling the lug to a surface of a plate such that the physical ground node is electrically coupled to an electrical ground node. The apparatus also includes a sensing circuit configured to detect whether the physical ground node is electrically coupled to the electrical ground node, and provide an indication of whether the physical ground node is electrically coupled to the electrical ground node based on the detection.
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