公开(公告)号：US20240276668A1

公开(公告)日：2024-08-15

申请号：US18643385

申请日：2024-04-23

申请人： Ciena Corporation

发明人： Mitchell O’Leary ,  Bonnie L. Mack ,  Trevor Meunier

IPC分类号： H05K7/14

CPC分类号： H05K7/142 ,  H05K7/1427

摘要： A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

公开(公告)号：US20240345342A1

公开(公告)日：2024-10-17

申请号：US18133011

申请日：2023-04-11

申请人： Ciena Corporation

发明人： Peter Ajersch ,  Trevor Meunier ,  Mitchell O’Leary

IPC分类号： G02B6/42

CPC分类号： G02B6/4269 ,  G02B6/4277

摘要： An optical system including: a faceplate including a receptacle adapted to receive a pluggable optical module; and one or more of: a thermal pad disposed adjacent to at least one interior side of the receptacle, wherein the thermal pad is adapted to be in thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from a nose of the pluggable optical module to the faceplate; and a heat sink disposed at an interior side of the receptacle, wherein the heatsink is adapted to be in physical contact and thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from the nose of the pluggable optical module to an air flow present behind the faceplate.

公开(公告)号：US20230336246A1

公开(公告)日：2023-10-19

申请号：US18340262

申请日：2023-06-23

申请人： Ciena Corporation

发明人： Marc Leclair ,  Mitchell O’Leary ,  Nicola Benvenuti ,  James McGale ,  Daniel Rivaud ,  Sheldon Button

IPC分类号： H04B10/25 ,  H04B10/80 ,  H04B10/40

CPC分类号： H04B10/40 ,  H04B10/25 ,  H04B10/801

摘要： A host module configured for insertion into a chassis of a network element includes a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; and a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each. At least one of the one or more universal sub slot modules can be a coherent modem or a router.