公开(公告)号：US20080279998A1

公开(公告)日：2008-11-13

申请号：US11801288

申请日：2007-05-09

Applicant: Chung Sik Park

Inventor： Chung Sik Park

IPC: A47J37/08 ,  A23L1/01

CPC classification number: A47J37/085

Abstract: A toaster having at least one toasting slot includes at least one sensor operative to generate a sensor signal indicating whether or not a food item is loaded in said slot and heating elements for generating heat energy to toast a food item loaded in the toasting slot by use of an electrical current. The toaster also includes at least one switching unit that is responsive to the sensor signal and operative to control the electrical current flowing through the heating elements such that the switching unit cuts off the electrical current when the slot is unloaded.

Abstract translation: 具有至少一个烘烤槽的烤面包机包括至少一个传感器，其操作以产生传感器信号，所述传感器信号指示食物是否装载在所述槽中，并且用于产生热能的加热元件用于通过使用来加载在烘烤槽中的食品 的电流。 烤面包机还包括至少一个开关单元，其响应于传感器信号并且可操作以控制流过加热元件的电流，使得当槽被卸载时切换单元切断电流。

公开(公告)号：US20140060908A1

公开(公告)日：2014-03-06

申请号：US14115138

申请日：2012-04-26

Applicant: Chung Sik Park ,  Duk Nam Kim ,  Jae Hyun Ahn

Inventor： Chung Sik Park ,  Duk Nam Kim ,  Jae Hyun Ahn

IPC: H05K3/38 ,  H05K1/02

CPC classification number: H05K3/388 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/48227 ,  H05K1/0201 ,  H05K1/0206 ,  H05K3/4038 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0369

Abstract: A printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers in a layered structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer. The adhesive property between the copper layer and the insulating layer is improved. The vias used to connect interlayer circuits to each other are formed between a plurality of insulating layers through an etching process instead of a laser process or a polishing process, thereby improving the process ability and reducing the manufacturing cost.

Abstract translation: 印刷电路板包括第一绝缘层，在第一绝缘层上的第二绝缘层，以及至少一个通过第一和第二绝缘层以分层结构形成的通孔。 通孔包括通过第一绝缘层形成的第一通孔层，在穿过第二绝缘层时形成在第一通孔层上的第二通孔层，以及在第一和第二通孔层之间的粘合剂层。 第一通孔层具有与第二通孔层的一部分不同的部分。 铜层与绝缘层之间的粘合性提高。 用于通过蚀刻工艺而不是激光工艺或抛光工艺在多个绝缘层之间形成用于连接层间电路的通孔，从而提高了处理能力并降低了制造成本。