公开(公告)号：US20180113151A1

公开(公告)日：2018-04-26

申请号：US15790185

申请日：2017-10-23

Applicant: Chroma Ate Inc.

Inventor： Xin-Yi WU ,  Chien-Hung LO ,  Jui-Chih CHOU ,  Hao-Che YANG ,  Nan-Yi KUO

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0458 ,  G01R31/2831 ,  G01R31/2877 ,  G01R31/2881

Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.

公开(公告)号：US20140368999A1

公开(公告)日：2014-12-18

申请号：US14291573

申请日：2014-05-30

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Jui-Chih CHOU ,  Hsuan-Jen SHEN

IPC: H05K7/20 ,  F28D15/00

CPC classification number: F28D15/00 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

Abstract translation: 用于插座的温度控制模块设置有上对接板和下对接板。 上对接板具有用于容纳插座的凹部和两个温度控制流体通道。 通路的一端与凹部连通，另一端与温度调节型流体源连接。 下对接板设置在上对接板下方并覆盖凹部。 流体室由对接板，下部对接板和插座的凹部形成。 温度控制流体源通过温度控制流体通道将温度控制流体输出到流体室，用于将插座保持在特定温度。