Method and apparatus for fabricating weak link junctions on vicinally
cut substrates
    2.
    发明授权
    Method and apparatus for fabricating weak link junctions on vicinally cut substrates 失效
    用于在邻近切割的基底上制造弱连接结的方法和装置

    公开(公告)号:US5656575A

    公开(公告)日:1997-08-12

    申请号:US387594

    申请日:1995-02-13

    申请人: Carl H. Mueller

    发明人: Carl H. Mueller

    IPC分类号: H01L39/22 C30B25/02

    CPC分类号: H01L39/225 Y10S505/702

    摘要: The present invention provides a superconducting device having a weak link junction with an angle at the grain boundary between the two superconductor crystals being variable. The angle at the junction is substantially equivalent to a vicinal angle for the substrate. Accordingly, the magnitude of the angle at the junction can be varied by varying the vicinal angle of the substrate. This result can be realized by using buffer layers of different compositions underlying the superconducting materials on either side of the weak link junction. Weak link junctions and reproducible properties are essential for a variety of electronic and magnetic sensing devices.

    摘要翻译: 本发明提供了具有可变的两个超导体晶体之间的在晶界处的角度的弱连接结的超导装置。 接合处的角度基本上等于衬底的邻角。 因此,可以通过改变衬底的邻角来改变接合处的角度的大小。 该结果可以通过使用在弱连接点两侧的超导材料下方的不同组成的缓冲层来实现。 弱连接点和可再现性质对于各种电子和磁感测装置至关重要。