公开(公告)号：US11710595B2

公开(公告)日：2023-07-25

申请号：US16809511

申请日：2020-03-04

申请人： CYNTEC CO., LTD.

发明人： Yi-Ting Lai ,  Jen-Chuan Hsiao ,  Yuan-Ming Chang ,  Hsieh-Shen Hsieh

IPC分类号： H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F1/147 ,  H01F1/34 ,  H01F41/02 ,  H01F27/32

CPC分类号： H01F27/22 ,  H01F1/14708 ,  H01F1/14766 ,  H01F1/344 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F27/325 ,  H01F41/0246 ,  H01F41/04

摘要： An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.

公开(公告)号：US20230335327A1

公开(公告)日：2023-10-19

申请号：US18207670

申请日：2023-06-08

申请人： CYNTEC CO., LTD.

发明人： Yi-Ting Lai ,  Jen-Chuan Hsiao ,  Yuan-Ming Chang ,  Hsieh-Shen Hsieh

IPC分类号： H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F1/147 ,  H01F1/34 ,  H01F41/02 ,  H01F27/32

CPC分类号： H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F1/14766 ,  H01F1/14708 ,  H01F1/344 ,  H01F41/0246 ,  H01F27/325

摘要： A method of fabricating a magnetic component structure with thermal conductive filler, including steps of providing a mold with a coil mounted therein, potting the mold with a thermal conductive material to form a thermal conductive filler encapsulating at least a portion of said coil, releasing the thermal conductive filler and the coil from the mold, and combining the thermal conductive filler with magnetic cores to form a magnetic component structure.

公开(公告)号：US20200286667A1

公开(公告)日：2020-09-10

申请号：US16809511

申请日：2020-03-04

申请人： CYNTEC CO., LTD.

发明人： Yi-Ting Lai ,  Jen-Chuan Hsiao ,  Yuan-Ming Chang ,  Hsieh-Shen Hsieh

IPC分类号： H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F27/32 ,  H01F1/147 ,  H01F1/34 ,  H01F41/02 ,  H01F41/04

摘要： An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.